Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,*,EP,,Heading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (yyyy/mm/dd),,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,,按一下以編輯母片標題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),,2005, BenQ Corporation,按一下以編輯母片標題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,BenQ,Confidential (2005/07/01),,2005, BenQ Corporation,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,Click to edit Master title style,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,Click to edit Master title style,,Heading Level One,,First line,,Second line,,Third line,,Fourth line,,Fifth line,,,,*,Titelmasterformat durch Klicken bearbeiten,,Textmasterformate durch Klicken bearbeiten,,Zweite Ebene,,Dritte Ebene,,Vierte Ebene,,Fünfte Ebene,,,,按一下以編輯母片標題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,,按一下以編輯母片標題樣式,,按一下以編輯母片,,第二層,,第三層,,第四層,,第五層,,演示文档,路漫漫其悠远,少壮不努力，老大徒悲伤,单击此处编辑母版标题样式,,单击此处编辑母版文本样式,,第二级,,第三级,,第四级,,第五级,,*,,*,详解手机开发与设计流程,Topic,個人簡介,,明基,BenQ,簡介,,產品開發流程,,手機開發功能區塊,,手機系統演進,,3G,介紹,,手機功能發展趨勢,,無線通信發展趨勢,,,個人簡介,,個人簡介,2000,年畢業於中山大學物理研究所,,2001.04~2006.03:,明基儲存事業部研發處研發部,,Team Leader of Write Strategy Team / Firmware R&D,,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x) drive development,,團隊發表世界第一的,4x, 8x, DL, 16x DVD,燒錄機,,IEEE,論文發表,,發表,4,篇專利,,2006.03~2006.12:,明基移動通訊事業群專案管理部,,技術產品經理,-,目前負責,3.5G HSDPA feature phone project,明基,BenQ,簡介,-,享受快樂科技,,數位時尚品牌,3C,數位整合 國際級設計實力,1984,年成立,,企業願景,:,傳達資訊生活的真善美,,1996,年股票在台灣上市,,2001,年,BenQ,品牌誕生,,2005,年營收,:,,明基電通,:,新台幣,1,623,億元,,明基集團,:,新台幣,3,979,億元,,全球員工人數,(2006/10),,明基電通,: 13,000+,人,,明基集團,: 68,000+,人,,「量做精品」,:,量身訂做讓消費者生活,,充滿樂趣的網絡時尚產品,,獨特,3C,產品組合：將數位產品整合成符合未來消費者生活型態的數位中樞 一,,筆記型電腦、手機、數位電視,享受快樂科技之企業,化企業願景為品牌使命,,1992,2002,,明基集團企業願景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,,Corp.,單位,:,億元,(,新台幣,),,,,,,,Phase 1,,,1984-1991,,OEM,,,,,,,強大的,,生產製造能力,,,,從製造代工到深耕技術與設計之品牌,Phase 2,,,1991-2001,,From OEM to ODM,,,,,,,多元化的技術投資,,“水平整合,+,專業分工”,,,Phase 3,,,2001-2006,,From ODM to Branded Business,,,,,,數位時尚品牌,,3C,數位整合,,國際級設計實力,,單位,:,億元,(,新台幣,),三大事業群,明基電通,移動通信,,事業群,,(MCG),數位媒體,,事業群,,(DMG),整合製造服務,,事業群,(IMS),洞悉數位市場 掌握絕對優勢,獨特,5C,策略 強化競爭優勢,電子商品整合趨勢贏家,Computing,,資訊產品,,個人電腦,,,液晶顯示器,,,,電腦週邊,,Consumer Electronics,,數位媒體產品,,數位投影機,,,液晶電視,,,,個人無線影音,,,,,數位相機,,,車用顯示器,Mobile Communications,,移動通信產品,,行動電話,產品開發流程,產品開發流程,Proposal,構想階段,,Plan,評估規劃階段,,Design,設計階段,,Execute,研發執行階段,,Mass production,生產階段,,Close,結束階段,,,,,,C System,,C1,Planning,,Phase,,,C2,R&D Design,,Phase,,,C3,Lab Pilot,,Run Phase,,,C4,ENG Pilot,,Run Phase,,,C5,PD Pilot,,Run Phase,,Mass,,Production,,Phase,,,C6,,C0,Proposal,,Phase,,,Planning-PM,,,Manufacture,,-Factory,Design-RD,,,Product definition,,Feasibility analysis,,ID initiation,Organize Project team member,,Project schedule,HW/SW design,HW/SW design lock down,,HW/SW design approved,Verification of Product maturity verification,,Production line set up,Verification of production line maturity /stability,,Product design finalized,Mass production,DVT Phase,MVT Phase,QVT Phase,,,,DVT : Design Verification Testing,,MVT: Manufacture Verification Testing,,QVT : Quality Verification Testing,,,,,,,,LPR: Laboratory Pilot Run,,EPR: Engineering Pilot Run,,PPR: Production Pilot Run,,MP: Mass Production,Mobile development function Introduction,Mobile development function,外觀設計,(ID),Industry Design,,機構設計,(MD),Material Design,,硬體設計,(HW) Hard Ware,,BB (Base Band,基頻,),,RF (Radio Frequency,射頻,),,Antenna (,天線,),,軟體設計,(SW) Soft Ware,,MMI (Man Machine Interface,人機介面,),,Protocol,,Driver,Functional Architecture of Mobile Today,Feature List-HW,[Camera ],,Sony 2.0 Mega Pixel CMOS Auto Focus camera,,[Strobe],,LED flash light,,[Display],,AUO 2.0” AMOLED 176x220 Pixels , 262K colors,,[Memory],,NOR Flash: 128Mbit, PSRAM: 64Mbit, NAND: 256Mbit,,SDRAM : 128Mbit,,[External Memory],,T-Flash,,[I/O],,DC Jack , 10 pin I/O,,[Connectivity],,USB1.1 , Bluetooth,ID,Vol. Up / Vol. Down,2 Segment Shutter Key,,,Mode Switch Key,,10 Pin I/O,,DC Jack,,,Microphone,Receiver,,T-Flash Card,,MD : Appearance treatment description,A,鋁板陽極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,,Q,噴漆,Exploded drawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14,17,16,Front case assy.,,Keypad assy.,,Main lens,,Joystick cap,,OLED module,,Receiver,,Keypad FPC,,Main PCB assy.,,DSC module,,DSC FPC,,DSC holder,,Speaker,,Vibrator,,Rear case assy.,,Antenna cover,,Battery cover.,,Battery pack.,Placement description - I,Shielding case 1 -BB,Shielding case 2 -BB,T-flash connector,,(push-push type),Pogo pin (for ESD),Back-up battery,,(Capacitor),30pin BTB Conn.,,(for DSC module),Joystick,,(Mitsumi),SMT-type MIC,Placement description - II,I/O connector,Battery connector,Mode switch,BT antenna switch,DC jack,Antenna connector,Antenna switch,Side-key (Vol-key),RF shielding case,10 pin Conn.,,(Spk. and flash),LCM connector,BB shielding case,SIM connector,Key FPC connector,HW Block Diagram-2G,,Placement (Top Side),,Antenna,RF Area,,10 Pin I/O,Battery Connector,,,,IOTA,SIM Connector,G2,3 Combo,,Memory,,,,,LCDM Connector,,Keypad Connector,,BT Area,,DC Jack,Placement (Bottom Side),Audio CODEC,,,MMP,MIC.,,,T Flash Connector,,OLED Limit Area,,Level Shifter,Camera Connector,,,Receiver,,Charging IC,Power IC,,Antenna,SW Feature Review,Band,Tri-band GSM/GPRS 900/1800/1900, GPRS Class 10,,Tri-band GSM/GPRS 850/1800/1900, GPRS Class 10,Speech Codec,FR/EFR/HF/AMR,Embedded DSC,2.0 Mega Pixel CMOS sensor with Auto Focus + LED flash light,Memory,RSS 3 combo: NOR flash: 128Mb, Pseudo SRAM: 64Mb, Super-AND: 256Mb, SDRAM: SH-Mobile J2 embedded 128Mb,Connectivity,USB 1.1 (MSC, CDC, Pict-Bridge), Bluetooth (A2DP, HS/HF, BIP, OPP, DUN),Java,MIDP 2.0, CLDC1.1, JTWI,MP3, Melody,MP3/AAC(3D, EQ)/AAC+, SW-MIDI,Voice recording,,AMR,Video recording/playing,,MP4, 3GP, H.263,DRM,OMA DRM 1.0,SW,Architecture-2G,,Tool,MMI,XPI ( Extend Programming Interface),Layer-1 / Driver,Service,,Display,,Input,,Menu,,PPF,,…,AP,,Camera,,MP3,,PIM,,Tool,,…,Protocol,,CC,,WAP,,STK,,Java,,…,Message,,SMS,,EMS,,MMS,,Email,,…,PS ( Protocol Stack),OS,,,,,,手機系統演進,3G Evolution Overview,Analog,cdmaOne,,[US],GSM [Europe],TDMA [US],PDC [JP],GPRS,EDGE,WCDMA,,(UMTS, ULTRA FDD),HSDPA,cdma 2000,cdma2000,,(1xEVDO),cdma2000,,(1xEVDV),TD-SCDMA,,[China],1G,2G,2.5G,3G,3.5G,3G introduction,,,RF chipset,BB chipset,,Power Mgmt IC,3G Mobile HW,Sirius BREW-3G,,,,,,Applications,Device driver,Services,,BREW OEM,,BREW,,Extensions,,,BREW,,,,3G,手機單晶片趨勢,多模式應用,WEDGE,晶片,( WCDMA+EDGE),,支援,WCDMA,、,EDGE,、,GPRS,、,GSM,和,HSDPA,標準,,可以在,2G,和,3G,網路間切換（,roaming,）,,以,CMOS,製程應用,,,達到低成本減少零組件數、縮小尺寸、降低功耗，及提高效能等,3G -->3.5G,HSDPA,網路陸續開通,,3G,升級到,3.5G,，不需再進行基地台建設，只需軟體升級,,3.5G,網路的下載傳輸速率已達,3.6Mbps,(,比,3G,快,9,倍,,,甚至高於一般家用的,2M,ADSL),,2010,年預計,行動數據服務,將會超越,行動語音服務,，為手機系統業者最重要的收入來源,,預計全球,3.5G,用戶數將從,250,萬個,(2006,年,),，成長到,3,億,個,(2011,年,),,,台灣業者,,中華電信,:,採諾基亞的系統,,,只開通支援,1.8Mbps,的,HSDPA,網路服務,,遠傳電信,:,採易利信的系統,,,推廣傳輸速率高達,3.6Mbps,的,HSDPA,網路,,支援,3.6Mbps,的手機尚未到位，只能以,3.5G,數據網卡先行,,困難,–,2007,年會大幅改善,,網路涵蓋率不足,,3.5G,手機選擇少,,,價格高,手機功能發展趨勢,-,高整合化,重外觀設計,,個人化,,多媒體,,多用途,手機功能發展趨勢,-,整合通訊,(Voice),，資訊,(Data),，傳播,(Video),和無線,(Wireless),,現有功能,,Mobile/Music/Video/Camera/Recorder/Game,,Storage Memory/FM radio/Application/Brower/High data rate/Connectivity : E-mail, BT, USB, IrDA/Light/Indicator/ Voice recognition,,GPS/A-GPS ->,定位導航,/LBS,位置資訊服務（,Location Based Services,）,,TV-Out,,2D Bar code/QR Code,,新功能發展,,數位電視,DVB-H /,廣播,,Finger Printer,,電子錢包,:NFC,近距離無線傳輸（,Near Field Communication, NFC,）,,Projector,,手機投影,無線通信發展趨勢,無線通信發展趨勢,Functional Architecture of Mobile Tomorrow,FMC ( Fixed-Mobile Convergence),固網行動聚合,固網和行動網融合,: FMC,（,Fixed-Mobile Convergence)-,無縫隙不間斷的通訊品質,,由各種裝置、服務、網路，以及技術所融合而成,What’s IMS?,What’s IMS?,UMA-Unlicensed Mobile Access,提出一套解決方案，讓使用授權頻段的,GSM,和,GPRS,和使用無需授權頻段的,Bluetooth,和,802.11,彼此間能夠互相漫遊,,可用單一手機享受雙網合一的優勢，甚至兼具節省話費的好處。
UMA,（,Unlicensed Mobile Access,）,,對用戶來說，採用,UMA,的技術後，在手機網路和,WiFi,或,Bluetooth,網路之間的切換是由系統來完成的，用戶一點感覺都沒有,Question?,。
